| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
1996-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8430787827e7607503a7c74992b25d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e46e495b8c7c6d7f10600fea91793420
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a2e424c96eb14e54195670a2ed1518d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4aec000ac13cd3f5c930bb0c78f5777e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54571a05b9c40e5625d2bdce50936718
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50559387b223a611ec230d290e2f88b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f66cb984d0c997f5cea9b68945d99127 |
| publicationDate |
1997-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09204816-A |
| titleOfInvention |
Conductive paste and conductive composition and use thereof as a conductive connector |
| abstract |
(57) Abstract: A remeltable conductive paste and a composite material containing no flux composition are provided. The conductive paste of the present invention contains a thermoplastic polymer, a conductive metal powder, and an organic solvent system. The present invention also provides a conductive composite material containing the above thermoplastic polymer and a metal. The metal comprises at least about 30% by volume of the total volume of the composite material. This composite material is formed from a paste at high temperature. This paste is used in the process of electrically connecting electrical and electronic components under the condition that the paste is converted into a composite material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109072041-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6512183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100390638-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018181625-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018181625-A1 |
| priorityDate |
1996-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |