http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09202850-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12 |
| filingDate | 1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb2b8339bd0bf7f245feaa6e0a080dd7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d725d5ca7a026d34b68df8c199300e6e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3397eef519b42a73434c8a4fc25b4907 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a999dd61d80f67988d18737c97bd408 |
| publicationDate | 1997-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09202850-A |
| titleOfInvention | Encapsulating epoxy resin composition, semiconductor device using the same, and method for producing the encapsulating epoxy resin composition |
| abstract | (57) Abstract: An encapsulating epoxy resin composition capable of obtaining an encapsulating layer without cracks when exposed to a high temperature such as solder reflow, a semiconductor device using the same, A method for producing the encapsulating epoxy resin composition is provided. An epoxy resin composition for sealing is an epoxy resin containing 45% by weight or more of a biphenyl type epoxy resin as a constituent material, and has a number average molecular weight of 1,000 to 3,000. It contains a polyphenylene ether resin, a curing agent, and an inorganic filler in the range of. A semiconductor device is sealed with this epoxy resin composition for sealing. The production method is as follows. A solution prepared by preparing a polyphenylene ether resin having a number average molecular weight of 1,000 to 3,000 is mixed with a phenol compound as a curing agent and mixed, and the solvent in the solution is removed, followed by an epoxy resin and an inorganic filler. Are blended, kneaded by heating, and solidified by cooling. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014095090-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010053179-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112812721-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112812721-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014159555-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7101933-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010503753-A |
| priorityDate | 1995-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.