| abstract |
(57) [Abstract] [Problem] Excellent in dryness to the touch after provisional drying and development life, In addition, an alkali-developable light that provides a cured coating film with excellent adhesion, electrical insulation, electrolytic corrosion resistance, solder heat resistance, solvent resistance, alkali resistance, acid resistance, plating resistance, etc. required for solder resist. Provided is a curable / thermosetting solder resist ink composition. The composition has (A) a carboxyl group and at least two ethylenically unsaturated bonds in one molecule, and a solid content acid value of 50 to 150 mgKOH / g. Of the photosensitive prepolymer, (B) a photopolymerization initiator, (C) an organic solvent, and (D) a crystalline melting point of 130 to 160 ° C., It is preferably in the range of 135 to 160 ° C. and contains a polyfunctional epoxy compound which is hardly soluble in the organic solvent (C). In particular, as the polyfunctional epoxy compound (D), α-triglycidyl isocyanurate having a structure in which epoxy groups are attached in the same direction with respect to the S-triazine ring skeleton surface is preferably used. |