http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09176283-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1995-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c67c423fde48a9b2e4675994d8b841a |
| publicationDate | 1997-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09176283-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | (57) [PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation, which improves adhesiveness between a lead frame and a semiconductor chip and remarkably improves soldering stress resistance of a semiconductor package during mounting on a substrate. An equation (1) having a softening point of 50 to 90 ° C. An epoxy resin represented by the formula, a phenol resin curing agent having a softening point of 55 to 130 ° C., a curing accelerator represented by the formula (2), and an inorganic filler as essential components, and the inorganic filler in the entire composition. An epoxy resin composition for semiconductor encapsulation containing 70 to 92% by weight. Embedded image (However, R in the formula (1) is the same or different atom or group selected from hydrogen, halogen and alkyl groups.) (However, in the formula (2), R 1 to R 4 are monovalent organic groups, and at least one of Y 1 to Y 4 is a group formed by a proton donor releasing one proton. .) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6306792-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6524989-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6946421-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001247652-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6881812-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4702764-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005082624-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1106617-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4491897-B2 |
| priorityDate | 1995-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.