| abstract |
(57) [Summary] [Structure] Metal foil with resin having a film of thermosetting polyphenylene ether resin on one side of the metal foil, sequential multi-layer laminate in which the metal foil with resin is laminated and bonded, and resin thereof A method for producing a sequential multilayer laminate, wherein the operation of adhering the resin-coated metal foil by stacking the resin-coated metal foil and heating and pressing the resin foil is performed once or more. [Effect] In addition to high-density wiring, a wiring board for high-speed circuits and high-frequency circuits can be manufactured. |