http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09169899-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
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filingDate 1995-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c7bc05d8ded275c6b8ded2edace6d02
publicationDate 1997-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09169899-A
titleOfInvention Unsaturated polyester resin molding material
abstract (57) An object of the present invention is to provide a molding material having a high dielectric breakdown strength while maintaining other electric characteristics which an unsaturated polyester has conventionally. According to the present invention, 15 to 30 parts by weight of an unsaturated polyester resin having an oxidation of 25 KOH mg / g or more is mixed with 40 to 85 parts by weight of silica, glass beads, and glass fibers, alone or in combination, and an inorganic filler other than the above is added. An unsaturated polyester resin molding material comprising 0 to 30 parts by weight of a material and 0 to 0.3% of carbon as one component of a pigment.
priorityDate 1995-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.