| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0f8dc752059a228fada0efdcc2901b9 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D183-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D183-04 |
| filingDate |
1995-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_918870ee8bcc95392c887b84e5fb0432
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0b708160c0c226949c794f80e228b20 |
| publicationDate |
1997-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09151334-A |
| titleOfInvention |
Electronic component protection material composition |
| abstract |
(57) [Abstract] [PROBLEMS] To provide an electronic component protective material composition capable of forming a cured film having excellent adhesion to a resin for semiconductor encapsulation used in electronic components. [Structure] An electronic component protective material composition comprising (A) a hydroxyl group-containing acrylic functional organopolysiloxane and (B) a photopolymerization initiator. |
| priorityDate |
1995-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |