http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09148511-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 1995-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_603d1ddd020f5e18bd021dab69540ad2 |
| publicationDate | 1997-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09148511-A |
| titleOfInvention | Manufacturing method of electronic component mounting board |
| abstract | [PROBLEMS] To provide a method for manufacturing a substrate for mounting electronic parts, which can prevent adhesion of a prepreg resin to an outer end portion of a lead and is easy to manufacture. SOLUTION: The outer lead portion 212 of a lead 21 is formed on both surfaces of the outer lead portion 212 so as to traverse the outer lead portion 212 and the outer tip portion 213 thereof. The strip-shaped dam resin 1 is arranged in a state where the resin is exposed, and the adhesive resin layer 32 and the release layer 31 are further arranged on both surfaces thereof. Next, these are pressure-bonded to close the lead gap 219 between the outer lead portions 212 with the dam resin 1 and bond the release layer to the outer lead portions via the adhesive resin layer. Next, the prepreg resin 5 is supplied to the surface of the lead frame 2 to form the substrate portion 9 and the conductor circuit 7 is formed on the surface, and then the prepreg resin, the release layer, and the adhesive resin layer on the surface of the outer lead portion. Also, the dam resin is removed to expose the outer lead parts. |
| priorityDate | 1995-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6335491 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426099531 |
Total number of triples: 13.