http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09148438-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 1995-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e29e8863f18551d959c520d21703221e
publicationDate 1997-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09148438-A
titleOfInvention Wiring plug formation method
abstract It is an object of the present invention to provide a method for forming a wiring plug that prevents the formation of plug loss. A wiring plug is formed by forming a connection hole in a SiO 2 insulating film formed on a surface of a substrate and forming a blanket layer with a wiring material in the connection hole and on the entire surface of the insulating film. Then, in the method for forming a wiring plug in which the blanket layer on the insulating film is etched to fill the connection hole, the surface layer formed mainly of the S (sulfur) -containing substance is used as the inner wall surface of the chamber and the inside of the chamber. The blanket layer 48 is etched using a plasma etcher that includes a chamber on the exposed surface of the component located at. As a result, a wiring layer having no wiring defect and a wiring layer having a stacked contact structure can be formed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8482058-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008252113-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232595-B2
priorityDate 1995-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559526
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419573697
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID402
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9397

Total number of triples: 20.