| abstract |
PROBLEM TO BE SOLVED: To provide a probe 10 formed to give a shape image and a thermal image of a semiconductor device. A probe 10 comprises a first ribbon of material 11 and a second ribbon of material 12 forming a thermocouple junction 13. Next, the probe tip 15 is attached to the epoxy 14 It is attached to the thermocouple junction 13. In another embodiment of the present invention, the probe 20 has a point region 17 formed by bending a portion of the thermocouple junction 13, the point region 17 being coated with a heat transfer material. The optical signal is reflected from the first ribbon of material 11, the second ribbon of material 12, or the flat portion of the thermocouple junction 13, so that movement of the probes 10, 20 can be monitored by a photodetector. |