http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09143251-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1995-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_811ab8641038f3084fcbbf2559147976 |
| publicationDate | 1997-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09143251-A |
| titleOfInvention | Epoxy resin molding material for encapsulating electronic parts and semiconductor device |
| abstract | (57) [Summary] [Object] To provide an epoxy resin molding material for encapsulating an electronic component, which has good adhesiveness to an IC chip and a lead frame and excellent mold releasability. [Structure] A) an epoxy resin having two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxyl groups in one molecule, and (C) a functional group reactive with a phenolic hydroxyl group. Having Polyolefin (C-1) An epoxy resin molding material for encapsulating an electronic component, which comprises a copolymer of a polymer (C-2) having a hydroxyphenylene group as a structural unit as an essential component. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001031941-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004156051-A |
| priorityDate | 1995-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.