| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_758994071efb42b565fc2c04637be131 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
1995-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69ba33bd7cf37a5746306747d499ad4a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b33d1de347b6b6ed8b7686e11952f2fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ceab4a4505183ce21a5afcaaf90c8f3 |
| publicationDate |
1997-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09138504-A |
| titleOfInvention |
Photosensitive resin composition |
| abstract |
(57) [Abstract] [PROBLEMS] To provide a photosensitive resin composition having excellent solder heat resistance and electrical characteristics. SOLUTION: The epoxy resin modified product (A) having at least one ethylenically unsaturated double bond group in the molecule, and at least one quaternary ammonium salt group and at least one ethylenically unsaturated double bond group in the molecule. A photosensitive resin composition comprising the modified epoxy resin (B). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005311233-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4700924-B2 |
| priorityDate |
1995-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |