| abstract |
(57) Abstract: Even when a heating step is performed after forming a resist pattern, a high performance that does not cause a decrease in adhesiveness or peeling of the resist layer due to cracking of the resist layer or volume shrinkage. Provided is a photocurable liquid solder resist ink composition. In a photocurable liquid solder resist ink composition containing a photocurable resin as an essential component, polymer fine particles having a Tg of 20 ° C. or less are dispersed in the composition. |