http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09135065-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate | 1995-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9c3dca56329d3bbf232d395bce4399d |
| publicationDate | 1997-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09135065-A |
| titleOfInvention | Manufacturing method of printed wiring board |
| abstract | (57) [Abstract] [PROBLEMS] Since a paste-like solder deposition composition is applied to the entire surface of a component mounting pad, the thickness of a solder layer tends to vary. Due to the variation in the thickness of the solder layer, a component in component mounting The floating of the leads, the formability of the solder fillet, and the like have a bad influence on the connection reliability. SOLUTION: A component 5 is applied with a paste 5 composed of a lead salt of an organic acid salt and a flux component on a component mounting pad 2 coated with tin plating 4, and then the paste 5 is applied near the melting temperature of the eutectic solder. The mounting pad 2 for soldering is heated to form the solder layer 6 on the pad 2 for mounting components ((a) to (F)). On the component mounting pad 2 to which the paste 5 composed of the organic acid lead salt and the flux component is applied, tin plating 4 is applied in advance. Therefore, the portion where the solder layer 6 is formed by heating near the melting temperature of the eutectic solder is necessarily limited to the surface of the component mounting pad 2. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008047471-A |
| priorityDate | 1995-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.