Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
filingDate |
1995-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2194036be68d626e70d8f5754feb041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b50a91c9eeddb59455ae0a4466ebec98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bcf941f83429056a8152be14b7aaaca |
publicationDate |
1997-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H09130053-A |
titleOfInvention |
Method for manufacturing multilayer printed wiring board |
abstract |
(57) [Abstract] (Correction) [PROBLEMS] To provide a method for manufacturing a flame-retardant multilayer printed wiring board which is thin, has a small variation in thickness, has a smooth surface, and is suitable for high-density mounting. SOLUTION: An optical / thermosetting undercoating agent is applied to an inner layer circuit board made of a flame-retardant epoxy resin-impregnated glass cloth substrate, and after being made tack-free by irradiation with active energy rays, an interlayer insulating adhesive layer is formed. The copper foil having the above is laminated and then integrally cured by heating. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013140756-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013057017-A |
priorityDate |
1995-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |