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filingDate 1995-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffdd2c21a29d2d5945def40cf70ab65b
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publicationDate 1997-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0912685-A
titleOfInvention Liquid sealing material
abstract (57) [Summary] [Structure] (a) Liquid epoxy resin, (b) Polyfunctional cyanate ester and / or cyanate ester prepolymer, (c) Liquid at 25 ° C., having a molecular weight of 5000 or less, An elastomer containing a functional group capable of reacting with a cyanate ester group and containing at least one selected from an epoxy group, an amino group, and a hydroxyl group, and (d) a liquid encapsulation containing an inorganic filler as a main component. In the material, the mixing ratio of each component is (a) / ((a) + (b)) = 30 to 70, (c) by weight ratio. / ((A) + (b)) = 5 to 30, and (d) / ((A) + (b) + (c) + (d)) = 50-80 liquid sealing material. [Effect] When a semiconductor package is sealed with a liquid sealing material, a highly reliable semiconductor without peeling cracks can be obtained even after a pressure cooker test or a thermal cycle test, which is an industrial advantage.
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