| abstract |
(57) Abstract: [PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation, which is excellent in electrical characteristics, fast curing property, storage stability and moisture resistance. SOLUTION: Triphenylphosphine and at least 2 Melt mixture obtained by previously heating and melting a phenol compound curing agent having at least two hydroxyl groups, an epoxy resin having at least two epoxy groups, a tetra-substituted phosphonium / tetra-substituted borate compound and / or a tri-substituted phosphine / tri-substituted An epoxy resin composition containing a borane compound and an inorganic filler as essential components. |