| abstract |
(57) 【Abstract】 PROBLEM TO BE SOLVED: To obtain good screen printability and at 250 ° C. Provided is a resin composition for printing which can be cured at a low temperature as described below, can give a film having excellent heat resistance, flexibility, and adhesiveness with adhesive sheets when cured, and has a high resin concentration. SOLUTION: A printing resin composition obtained by dissolving a polyimide precursor resin having a silicone unit and an epoxy resin in an organic solvent, and a weight ratio of the polyimide precursor resin and the epoxy resin is 100: 5 to 70. Is. The printing resin composition of the present invention is excellent in screen printability, low temperature curability, heat resistance, flexibility, and adhesiveness with an adhesive sheet material, and therefore, for example, a surface coating material for a flexible printed circuit board or a multilayer rigid. Inner layer coating material for substrates, IC It is extremely useful as an industrial material for coating electronic material parts such as a coating material for LSI and a liquid crystal alignment film. |