http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09118740-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1995-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4e915aa151839424351328a8cb7bd48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e91bc98ef6ed9db6533d5ab6c7f0dea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df9de7cdf8b51f6a2d3850e80fbb34a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01738bd572aeb7bab9ccbd113e4716a6 |
| publicationDate | 1997-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09118740-A |
| titleOfInvention | Epoxy resin composition for encapsulation and semiconductor device using the same |
| abstract | (57) Abstract: An epoxy resin composition for encapsulation, which can obtain a semiconductor device having a low moisture absorption rate and good moisture absorption solder crack resistance and moisture resistance reliability, and moisture absorption solder crack resistance using the composition. Another object of the present invention is to provide a semiconductor device having improved moisture resistance reliability. The epoxy resin composition of the present invention is a biphenyl skeleton represented by the following general formula in a sealing epoxy resin composition obtained by adding a curing agent, an inorganic filler and a curing accelerator to an epoxy resin. 20 to 100 wt% of the epoxy resin having a total amount of the epoxy resin, a phenolic resin curing agent represented by the following general formula is contained 20 to 100 wt% with respect to the total amount of the curing agent, and It is characterized by containing 10 to 50% by weight of an inorganic filler having a particle diameter of 5 μm or less and 20 to 100% by weight of a spherical inorganic filler with respect to the total amount of the inorganic filler. |
| priorityDate | 1995-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.