| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate |
1995-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9b181fe715725d1ae6c0b59b87a0559 |
| publicationDate |
1997-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09115974-A |
| titleOfInvention |
How to monitor the remaining resist |
| abstract |
(57) Abstract: A method for promptly setting appropriate conditions for ashing is provided by visualizing a resist residue remaining on a plating adhesion layer. SOLUTION: After forming a resist pattern (6) having an opening on a plating adhesion layer (5), the wafer is immersed in dilute nitric acid at room temperature, and then the resist remains (8) with an optical microscope. Is characterized by visual inspection. |
| priorityDate |
1995-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |