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(57) Abstract: [PROBLEMS] To provide an epoxy resin composition that gives a cured product having low viscosity, low hygroscopicity, and high adhesiveness, and a resin-encapsulated semiconductor device using the same. (A) General formula (1) (In the formula, R 1 represents a hydrogen atom, a chain or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom, and R 1 may be the same or different from each other. Yes, and X is the formula Is a group represented by n shows the integer value of 0-4. ) An epoxy resin composition containing an epoxy resin represented by the formula (4) and a curing agent as main components, and a resin-encapsulated mold characterized by encapsulating a semiconductor element using the epoxy resin composition. Semiconductor device. |