| abstract |
(57) [Abstract] [Purpose] Suppresses the elution of copper from the copper wiring to the polyimide insulation layer, and also suppresses the occurrence of cracks in the insulation layer, providing excellent mechanical properties and interfacial adhesion of the insulation layer, and high reliability Wiring structure and low cost manufacturing method thereof. [Structure] When a polyimide precursor composition is directly applied to the surface of a copper wiring and is heat-cured to obtain a polyimide insulating film, a polyamic acid having a low carboxyl group acidity is used as a polyimide precursor. Alternatively, a polyimide precursor composition containing a basic compound is used. Further, the exposed portions of the copper wirings 14 and 14a are covered with a copper diffusion blocking layer 16 made of polyimide obtained by heating and polymerizing a polyamic acid having a low acidity so that the polyamic acid having a high acidity does not come into direct contact with copper. To do. |