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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 1994-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a247053fd0ac70148e64f47eebfda8a
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publicationDate 1996-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0897281-A
titleOfInvention Method for manufacturing semiconductor device
abstract (57) [Summary] [Purpose] To maintain polycide wiring contact ohmic even after heat treatment. [Structure] The polycide wiring composed of the polysilicon layer 4 and the tungsten silicide layer 5 is in contact with the N-type diffusion layer 1 in the contact hole 3a. The polysilicon layer 4 is formed as a polysilicon layer doped with phosphorus "in-situ" by using low pressure thermal CVD. After that, by performing sputtering using tungsten silicide (WSi 2 ) containing phosphorus at a high concentration as a target, the WSi 2 layer 5 containing phosphorus at about 1 × 10 20 to 10 × 10 20 atom / cm 3 is formed. . After that, even if a heat treatment is performed, since the WSi 2 layer 5 is doped with a high concentration of phosphorus, the phosphorus in the polysilicon layer 4 remains in the WSi 2 layer 5. It is suppressed to spread to. [Effect] Since phosphorus of the polysilicon layer 4 does not diffuse, the contact is maintained ohmic, and a contact resistance that is sufficiently low in practical use can be obtained.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009218610-A
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priorityDate 1994-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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