Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-10 |
filingDate |
1994-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d3d34dd234a1e973d18bb9040a31c08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0a5bfee5d581bf9f4a6c0d525fd6def |
publicationDate |
1996-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H0892470-A |
titleOfInvention |
Resin composition for semiconductor device transport container |
abstract |
(57) [Summary] [Structure] A resin composition for a semiconductor device transporting container, which contains the following components (A) to (E) in the following mixing ratio. (A) Thermoplastic polyester 20-45% by weight (B) Propylene-based resin 5-15% by weight (C) Propylene-based elastomer 5-15% by weight (D) Mica 10-45% by weight (E) Conductive carbon black 5 -30% by weight [Effects] Degassing of volatile impurities in IC allows long-time baking at a high temperature of 150 ° C, which was not possible in the past, and improves warp deformation due to rapid cooling after baking. It is possible to obtain a container having good impact strength and electrostatic level. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0106442-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9815596-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007056104-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6863177-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9743338-A1 |
priorityDate |
1994-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |