http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0892355-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1994-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe5b4c6b1384834cc40e8df95e8a11b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545ab069a1d0b17807b024864a9ba908 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1654ce92148b37e645be68e58c91d41 |
| publicationDate | 1996-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0892355-A |
| titleOfInvention | Resin composition |
| abstract | (57) [Summary] [Structure] In the epoxy resin (A) having two or more epoxy groups in one molecule and the phenol resin (B) having two or more phenolic hydroxyl groups in one molecule, the phenolic group of the epoxy group is The equivalent ratio to the hydroxyl group is 0.5 or more and 2 or less, and 1,8-diazabicyclo [5,4,0] -7-undecene as a curing accelerator and at least one proton are given to this DBU to give DBU and an ion. 0.5 parts by weight or more and 20 parts by weight of the salt (D) consisting of a carboxylic acid (C) having two carboxyl groups in one molecule forming a pair, per 100 parts by weight of (A) + (B). A resin composition containing the following, and further containing 40 parts by weight or more and 2400 parts by weight or less of the inorganic filler (E) per 100 parts by weight of (A) + (B). [Effect] The resin composition according to the present invention is excellent in curability and has excellent storage stability at room temperature. When the resin composition according to the present invention is used as a material for electronic and electrical parts, refrigeration storage and refrigeration transportation are unnecessary. There are great advantages to the industry. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6495270-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014125488-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016177055-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014103652-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9796828-B2 |
| priorityDate | 1994-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.