http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0883962-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_097405822d505467fd50f7100022cd56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 |
| filingDate | 1994-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85b9bc456cb06fd0a355dc957310fae0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6ddb2bdb7b8e73eab1d3125c4c7ab6f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_705ba8535a90ee52fc9dab4c8c371e8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_540bc7dfecf4c2881fa3b2dd98373916 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94435ab227f326190f3eeaf45b14b21a |
| publicationDate | 1996-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0883962-A |
| titleOfInvention | Copper clad laminate, printed wiring board manufacturing method, and multilayer printed wiring board manufacturing method |
| abstract | (57) [Summary] [Structure] A core material having a through hole is filled with a curable alkali-soluble resin composition in the through hole and provided as a layer on the surface of the core material. A step of forming a copper clad laminate provided with a copper foil on the composition; a step of etching the copper foil at a position above the through hole of the core material to form a hole in the copper foil; A step of dissolving and removing the first resin composition and the second resin composition under the hollow hole with an alkaline aqueous solution to re-pierce the through hole; a step of curing the resin composition; and a conductive material in the through hole. Forming step; a method of manufacturing a printed wiring board, comprising a step of forming a wiring pattern on the surface copper foil by etching. [Effect] The blind via hole and the through hole can be formed without using the heat press which is generally used in the manufacture of a multilayer printed wiring board, and without using the low productivity drilling which has been drilled hole by hole. It becomes possible to manufacture the multi-layered printed wiring board which it has with high productivity. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020017254-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003513456-A |
| priorityDate | 1994-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.