http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0881628-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate | 1994-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a90627721c921c64882788daf1780c9 |
| publicationDate | 1996-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0881628-A |
| titleOfInvention | Heat resistant conductive paste |
| abstract | (57) [Summary] [Structure] The present invention provides (A) a polyamic acid represented by the following general formula: A heat-resistant conductive paste comprising (B) an inorganic pigment and (C) a conductive powder as essential components. [Effects] The heat-resistant conductive paste of the present invention has excellent heat resistance and adhesiveness, does not generate voids or chip cracks, has no disconnection defects due to corrosion of aluminum electrodes, has high productivity, and contributes to cost reduction. It is a highly reliable device that can handle larger chips. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5343562-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011526960-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8759440-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10237300-A |
| priorityDate | 1994-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 191.