| abstract |
(57) [Summary] [Purpose] N laminated on a pad having a composition of Fe-Ni system. When bonding aluminum wires to the i-based plating film, To provide an aluminum wire bonding pad capable of improving the reliability of bonding. A surface modification layer having a Rz of 0.3 μm or less is formed on the entire surface of a pad main body 10 having a Fe—Ni composition, including a solder joint surface 11 and a wire joint surface 13. Further, a Ni-based plating film 10x is laminated on the surface modification layer. The Ni-based plating film 10x on the solder joint surface 11 side is the electronic substrate 20. The aluminum wire 55 is bonded to the Ni-based plating film 10x on the wire bonding surface 13 side by ultrasonic bonding processing. |