| abstract |
(57) [Summary] [Purpose] To realize a power semiconductor package that can withstand an accelerated life test of 150 ° C-1000h or longer and can be assembled at a low cost. [Constitution] Cu- (0.01-0.2%) Zr alloy or Cu- (0.01-0.06%) Cr alloy is used for the lead terminal material, Al-Si-Ni is used for the wire material, and wire bonding on the lead side There are two points. [Effect] By using the alloy having the above composition, it is possible to reduce the deterioration of the wire / lead joint at high temperature and prolong the service life thereof, and it is possible to provide a package having high temperature reliability and low cost. |