http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0877899-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H37-76
filingDate 1994-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f00277ceafb7784553509e5fbe48dcbb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94b9a102b53f0cf0c67ad2098ab472f0
publicationDate 1996-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0877899-A
titleOfInvention Alloy type temperature fuse
abstract (57) [Abstract] [Purpose] Even if exposed to a heat cycle, since the soldering part is sound, the occurrence of cracks in the flux layer on the low melting point metal piece is reliably prevented, and the operating characteristics of this place are guaranteed. A possible alloy type temperature fuse is provided. [Structure] A low melting metal piece 2 is used as a fuse element, and a flux suppressor against a heat cycle is added to the flux 3 in a temperature fuse in which the flux 3 is applied to the low melting metal piece. Unsaturated fatty acid amides are suitable as crack inhibitors.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009070803-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000030586-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7477130-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5982268-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4663758-B2
priorityDate 1994-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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