http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0873562-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1994-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0acb4e6ba433f7b67bf1e7f69be9e7da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad0cd7ce5c40fe7554ef392baa27491 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c972d3780118f9b41a8449dcc9ca3a8e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a5c8be8333be3df695696ac631d2eae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bfe856f9510de9b94a97fcbeac65344 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d6f7fbc055caedfe0ab9129a732bb20 |
| publicationDate | 1996-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0873562-A |
| titleOfInvention | Epoxy resin composition and resin-encapsulated semiconductor device |
| abstract | (57) [Abstract] [PROBLEMS] To provide an epoxy resin composition that gives a cured product having low viscosity, low hygroscopicity, and high adhesiveness, and a resin-encapsulated semiconductor device using the same. [Structure] (A) General formula (1) (Here, R 1 independently represents a chain or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom. R 2's each independently represent hydrogen or 1 to 1 carbon atoms. 6 represents a chain or cyclic alkyl group of 6, or a substituted or unsubstituted phenyl group, n is 0 to An integer value of 4 is shown. ) An epoxy resin composition containing an epoxy resin and a curing agent as main components, and a resin encapsulation obtained by encapsulating a semiconductor element using the epoxy resin composition. The present invention relates to a static semiconductor device. |
| priorityDate | 1994-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.