http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0862842-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33dafb5bbc2ec47ebcb7becbbe60f704 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 1994-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86b09f744baa2f9d1e74b9bebcc16d0d |
| publicationDate | 1996-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0862842-A |
| titleOfInvention | Composition, photosensitive resin, pattern using the same, and pattern manufacturing method |
| abstract | (57) [Summary] (Correction) [Purpose] To obtain a pattern having a surface relief structure having a large unevenness difference between an exposed portion and a non-exposed portion and having a smooth shape such as a sine wave shape. [Structure] The following general formula (I) or general formula (IV) (In the formula, R 1 to R 6 are hydrogen atoms or the following (however, in the general formula, m is an integer of 1 or more and 3 or less), And R 1 to R 6 are not all hydrogen atoms. Note that n is an integer of 1 or more and 6 or less. ) (In the formula, R 12 to R 20 are hydrogen atoms or the following (however, in the general formula, m is an integer of 1 or more and 3 or less), And R 12 to R 20 are not all hydrogen atoms. 5 to 90% by weight of a compound having a structural unit represented by the formula: (In the formula, R 7 represents a hydrogen atom or an alkyl group having 4 or less carbon atoms, and R 6 represents a cycloalkenyl group or the formula (III). (In the formula (III), R 9 , R 10 and R 11 each represent a hydrogen atom or an alkyl group, and z represents an integer of 1 or more and 5 or less.). ) A photosensitive resin composition containing 10 to 95% by weight of a polymer or copolymer having a structural unit represented by the formula (2). A pattern forming method in which a thin film of the photosensitive resin composition is exposed, and then unreacted compounds are removed by heating, decompression treatment or the like. |
| priorityDate | 1994-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.