http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H086254-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 1994-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ea6420fff1a8d6e9226d1eea40e08af http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87ca731d91a637aeaeb9d7cfc3786a5f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94c42679cf1fdbbf171a3157a06c41f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7daca9d8df49e0837e41656ad6ce92d2 |
| publicationDate | 1996-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H086254-A |
| titleOfInvention | Positive type radiation sensitive resin composition and pattern forming method using the same |
| abstract | (57) [Summary] [Structure] A chemically amplified positive-type radiation-sensitive resin composition utilizing an acid that generates an acid when exposed to radiation, characterized in that the composition contains a trityl compound. To prepare a positive-type radiation-sensitive resin composition, which is dissolved in a solvent to obtain a photosensitive solution. This photosensitive solution is coated on a substrate such as a silicon wafer or a chromium vapor deposition plate, and then 70- After drying by baking at a temperature of 130 ° C, the pattern is exposed by radiation such as far-ultraviolet rays or electron beams, or after drawing, it is further heated at a temperature of 70 to 130 ° C, and then developed by an alkaline aqueous solution to form a transfer pattern. To get [Effect] The positive-type radiation-sensitive resin composition and the pattern forming method of the present invention have high sensitivity to radiation, and the transfer pattern obtained from this composition has no swelling and is excellent in resolution and is also excellent in dry etching resistance and heat resistance. ing. |
| priorityDate | 1994-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 86.