http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0859790-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02K15-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14
filingDate 1994-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69824c13650e9a1c5cb8ad60692ea2fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23bcff3cb10fd0e218b50b7bff77e10c
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publicationDate 1996-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0859790-A
titleOfInvention Heat resistant dripping impregnation resin
abstract (57) [Summary] [Purpose] The dropping impregnating resin used as an insulating material for various electrical devices has a shorter curing time and a higher maximum permissible temperature for superior general versatility, and the mechanical strength and temperature of the cured product. It is an object of the present invention to provide a heat resistant dropping impregnated resin which satisfies the characteristics. [Structure] Cresol novolac type epoxy resin for increasing heat resistance of bisphenol type epoxy resin, cycloaliphatic type epoxy resin for increasing mechanical strength and temperature characteristics, and allyl methacrylate for imparting flexibility As a main component, a predetermined amount of an organic peroxide as a polymerization initiator is added to this main component, and the mixture is heated and stirred to obtain a heat resistant dropping impregnated resin. Cyclohexyl methacrylate or glycidyl methacrylate is used in place of allyl methacrylate as a material that imparts flexibility, tetrahydrophthalic unhydride is used as a curing agent, and 1,8-diaza-bicyclo (5,4,0) is used as a curing accelerator. ) Unden-7 -Use oleate.
priorityDate 1994-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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