| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_85ac19d92ea591614d2f2255a9e1b0d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-04941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
1995-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b3d4d30d54877bb4a90f445bf14d2af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3993db1413d13501440707aec770da6f |
| publicationDate |
1996-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0855873-A |
| titleOfInvention |
Electronic assembly and processing method |
| abstract |
(57) [Abstract] [Purpose] An improved method for processing integrated circuit dies, and An improved die and electronic assembly and an improved method of forming the assembly are provided. The integrated circuit die 2 has a region exposed on the top surface of aluminum that forms an oxide layer 13 thereon. Oxide layer 13 is etched away to form openings 12 on underlying aluminum region 10. A conductive protective layer 14 of titanium nitride is sputtered onto the upper surface of the die, after which a pad 7 of conductive thermoplastic 15 is deposited over the opening 12. The titanium nitride layer 14 is subsequently removed by etching, except where protected by the pad 7. The die 2 can then be flipped over and bonded to the substrate 1 by making an electrical connection between the pad 7 and the conductive region 8 on the substrate 1. |
| priorityDate |
1994-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |