| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-742 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
1994-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_490cda427c1c432339db468fb7b7449f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d001023667ad306c6713ef6fbe25fa9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f963738d41871fb4acb03ac2c2c7987 |
| publicationDate |
1996-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0855854-A |
| titleOfInvention |
Bump bonding machine |
| abstract |
(57) [Summary] [Purpose] Provided is a bump bonding apparatus capable of accurately verifying a stud bump formation state such as a stud bump size abnormality due to non-adhesion of stud bumps or other disturbances and an abnormal shape of the convex portion. To do. A bump bonding apparatus for forming a stud bump 3a to be an electrode on an IC 4 by a gold wire 2, A camera device 16 and a lighting device 17 having an irradiation light axis coaxial with the image pickup axis are further provided, and the reflected lights of the irradiation lights L 1 and L 2 emitted from the lighting device 17 and irradiated to the stud bumps are provided. By inspecting, the above-mentioned stud bump formation state is accurately verified. |
| priorityDate |
1994-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |