| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0233 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 |
| filingDate |
1994-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1996-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08509661-A |
| titleOfInvention |
Lead-free and bismuth-free tin alloy solder composition |
| abstract |
(57) [Summary]nLead and bismuth free solder alloy compositions for electronic industrial assembly applications have a reduced toxicity of 90.3 to 99.2% tin, 0.5 to 3.5% by weight. It consists of silver, 0.1 to 2.8% copper and 0.2 to 2.0% antimony. The alloy composition has a melting point of 210 ° C. to 216 ° C. and has excellent wettability and mechanical strength, which makes the alloy composition well suited for electronic circuit board manufacturing and replacement of conventional tin-lead solder. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0178931-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002239780-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015125855-A1 |
| priorityDate |
1993-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |