http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0848750-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate | 1994-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4e915aa151839424351328a8cb7bd48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01738bd572aeb7bab9ccbd113e4716a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df9de7cdf8b51f6a2d3850e80fbb34a2 |
| publicationDate | 1996-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0848750-A |
| titleOfInvention | Epoxy resin composition for encapsulation |
| abstract | (57) [Abstract] [Purpose] To provide an epoxy resin composition for semiconductor encapsulation, which provides an encapsulation product in which cracks are less likely to occur when exposed to high temperatures in a soldering process or the like. [Structure] Biphenyl epoxy resin mixture (A) containing a biphenyl epoxy resin (α) represented by the following general formula and a biphenyl epoxy resin (β) represented by the following general formula, and the following general It is characterized by containing a dicyclopentadiene / phenol polymer (B) represented by the formula. Embedded image |
| priorityDate | 1994-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.