| abstract |
(57) [Summary] [Purpose] A cured product with low viscosity, high flowability, excellent adhesion, excellent moldability with almost no molding defects such as voids during molding, and low expansion coefficient. And an epoxy resin composition suitable as a resin for semiconductor encapsulation is industrially advantageously obtained. [Composition] When manufacturing an epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, a curing catalyst and a silane coupling agent, the curing catalyst and the silane coupling agent are added in separate kneading steps. . |