http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H083757-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c6191997ed6dda6a5a3582e10b0b3dbc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52 |
| filingDate | 1994-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26bbbb3d9d4e6f83303719313c8d4bbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_570a34e41118b74f8d4ddf4139fb143a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2f286f15240b6379f23dba1ea261896 |
| publicationDate | 1996-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H083757-A |
| titleOfInvention | Tin-lead alloy electroless plating copper-based material manufacturing method |
| abstract | (57) [Summary] [Purpose] Stability of "tin-lead alloy electroless copper-based material" that has a plating film with minimal variation in film thickness and composition and excellent reflowability and wettability with base materials. Established manufacturing method. [Structure] A tin-lead alloy electroless plating layer is formed. Preliminary plating is performed to deposit a porous tin-lead alloy film on a copper-based substrate, and then substitutional tin-lead alloy electroless plating is deposited. After the treatment, it is further immersed in "an acidic aqueous solution containing chlorine ions and benzimidazole or its derivative". In this case, as the "substitution type tin-lead alloy electroless plating deposition treatment" performed after the pre-plating treatment, "tin-lead alloy electroless plating deposition treatment with a plating solution that produces a high tin content deposit" And the following "tin with a plating solution that produces a high lead content precipitate- It is preferable to apply a two-stage substitutional tin-lead alloy electroless plating deposition treatment method of "lead alloy electroless plating deposition treatment". |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100865923-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107365986-A |
| priorityDate | 1994-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.