| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-58 |
| filingDate |
1994-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a0c7e02b72c9d6a7dc53fe03d64f7d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab2ed7e672cd10d1a41ab3237c0a1f79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e5e4e645b1d4b81f09a99a42c431fa3 |
| publicationDate |
1996-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0834832-A |
| titleOfInvention |
Thermosetting resin composition and copper-clad laminate |
| abstract |
(57) [Summary] (Revised) [Purpose] A thermosetting resin composition that gives a cured product with excellent dielectric properties (both dielectric constant and dielectric loss tangent are low) and a copper clad laminate molded using the same. provide. [Structure] (1) (A) General formula (1) An epoxy resin represented by the formula (B) and a general formula (2) (In the formula, R 2 represents a hydrogen atom or a methyl group, and X, X'is a halogen atom. k and l are 1 independently It is an integer not less than 4 and not more than 4. ) And a compound obtained by previously reacting with a halogen-containing bisphenol compound represented by (2) Thermosetting resin composition in which a polycyanate compound having two or more cyanate groups in the molecule and (3) an epoxy curing agent are essential components, and the content of the polycyanate compound is 5 to 50% by weight. And an epoxy resin copper-clad laminate obtained by heating and molding a prepreg obtained by dissolving the composition in an organic solvent and impregnating the base material with a copper foil. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017048337-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0957123-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018009048-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013216881-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6380344-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1160677-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007056059-A |
| priorityDate |
1994-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |