http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08337641-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1995-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72241a116a842a97e5a9728182c9facb |
| publicationDate | 1996-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08337641-A |
| titleOfInvention | Epoxy resin composition and semiconductor encapsulation device |
| abstract | (57) [Summary] [Structure] The present invention provides (A) epoxy resin, (B) phenol resin, (C) silicon nitride powder, and maximum particle size of 30 μm. A composite filler of fine spherical alumina powder of m or less and (D) a curing accelerator are essential components, and the inorganic filler of (C) is contained in a proportion of 25 to 90% by weight with respect to the entire resin composition. And a semiconductor encapsulation device in which a semiconductor chip is encapsulated with a cured product of the epoxy resin composition. [Effect] The epoxy resin composition and the semiconductor encapsulation device of the present invention have excellent thermal conductivity and fluidity, as well as excellent moisture resistance and solder heat resistance. |
| priorityDate | 1995-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.