http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08335258-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B42D15-10
filingDate 1995-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b211de01b69e5819e79ce55752c07c
publicationDate 1996-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08335258-A
titleOfInvention Non-contact IC card and manufacturing method thereof
abstract (57) [Summary] (Corrected) [Purpose] A coil winding with a sufficient number of turns to increase the inductance of the coil, is resistant to bending and other stresses, and can be mass-produced at low cost. A non-contact IC card having a coil is provided. In a non-contact IC card including a coil portion that is electromagnetically coupled or electromagnetically induced on a substrate, the coil portion is provided on a wiring pattern portion for connection formed on the substrate and is disposed on the wiring pattern portion. A coiled wiring body having at least two layers or more to be connected, and a wiring pattern portion for connection has terminals for wiring or connecting wires for wiring, and at least two layers of coiled wiring body. Are fixed to a coil-shaped wiring body located on the substrate or a lower layer by a conductive layer and an insulating resin layer formed below the conductive layer, and the coil-shaped wiring body of two or more layers has one end. Is connected to the outside of the coil, and the other is connected to the inside of the coil, and is configured to be continuously connected in the same winding direction by the wiring pattern portion for connection.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100470283-B1
priorityDate 1995-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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