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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-00
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filingDate 1995-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca18bc2c77365e5c29b9028e73c155a0
publicationDate 1996-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08325349-A
titleOfInvention Epoxy resin composition and reinforcing adhesive sheet using the same
abstract (57) [Summary] [Structure] An epoxy resin composition containing an epoxy resin (component A), dicyandiamide (component B), an imidazole compound (component C), and a polyisocyanate (component D) is used to form a sheet. A reinforcing adhesive sheet in which an adhesive layer 2 made of the above epoxy resin composition is formed on the base material surface of a sheet-shaped base material 1. [Effect] The epoxy resin composition has excellent storability in a high temperature atmosphere of 40 to 60 ° C, and the reinforcing adhesive sheet using it has excellent reinforcing property.
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type http://data.epo.org/linked-data/def/patent/Publication

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