| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-10 |
| filingDate |
1995-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_572d6646a763b21f842b471f8f0ee6ff |
| publicationDate |
1996-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08325339-A |
| titleOfInvention |
Multilayer printed wiring board interlayer electrical insulation material |
| abstract |
(57) [Summary] [Structure] (A) A linear copolymer of a brominated bisphenol A type epoxy resin, a conjugated diene vinyl monomer and acrylonitrile, the polymer having carboxyl groups at both ends of the molecule. And an acid pendant type rubber-modified brominated epoxy vinyl ester resin having a structure in which a hydroxyl group of a rubber-modified brominated epoxy vinyl ester resin obtained by reaction with acrylic acid is reacted with tetrahydromaleic anhydride, (B) a diluent, An interlayer electrical insulating material for a multilayer printed wiring board, which comprises (C) a photopolymerization initiator and (D) a cresol novolac type epoxy resin. [Effect] In a multilayer printed wiring board obtained by the build-up method, an interlayer electric insulating coating film having excellent adhesion to copper plating forming a circuit and excellent flame retardant effect can be obtained. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113721423-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002275241-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013041114-A |
| priorityDate |
1995-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |