| abstract |
(57) [Summary] [Purpose] While maintaining good flowability and moldability, Provided are an epoxy resin composition having a low thermal expansion coefficient of the molded body, a method for producing the same, and a semiconductor device using the same. An epoxy resin composition having an inorganic filler content of 70 to 90% by volume with respect to the total amount of the epoxy resin composition, an epoxy group equivalent of 400 or less, and a viscosity at room temperature of 1000 centipoise or less. Also contains a silicone compound having a group, the content of this silicone compound, relative to the total amount of the epoxy resin composition, It is 0.1 to 2% by weight. The silicone compound, the epoxy resin, and / or the curing agent are stirred and mixed at 90 to 150 ° C., and mixed and kneaded with the remaining raw material containing the inorganic filler. An inorganic filler which has been surface-treated by adding a silicone compound is mixed and kneaded together with an epoxy resin, a curing agent and a curing accelerator. A semiconductor element mounted on a lead frame is sealed using the epoxy resin composition. |