| abstract |
(57) Abstract: An encapsulation molded electronic device package and a method for manufacturing the same are provided, in which the devices are self-aligned without damaging the devices. Provided is an encapsulated electronic component including a silicon element, a chip or an integrated circuit, which is easy to process and less likely to be damaged or displaced. This is compressible, An elastomeric, anisotropic, electrically conductive, leadframe supporting a compliant interconnect, It includes a plastic body that contains the silicon integrated circuits that are placed on the interconnect, all of which are included. |