| abstract |
(57) [Abstract] [Purpose] A varnish useful for heat-resistant coating materials, heat-resistant inks, heat-resistant films, heat-resistant prepregs, heat-resistant fibers, heat-resistant electric wires and heat-resistant laminated boards using the heat-resistant prepregs. Offer. [Structure] A resin composition comprising (a) an alkenylphenol compound having at least two alkenyl groups in one molecule and (b) a maleimide compound having at least two arraymid groups in one molecule is dissolved in an organic solvent. By doing so, a varnish useful for the above application is produced. |