http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08301987-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1995-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_092f5ced0f1b64f4157d8779e43302e5 |
| publicationDate | 1996-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08301987-A |
| titleOfInvention | Epoxy resin composition |
| abstract | (57) [Abstract] [Purpose] To provide an epoxy resin composition which does not cause fogging in a molding die even when continuous molding is performed. [Structure] The first composition is an epoxy resin having two or more epoxy groups, a curing agent, a filler containing silica as a component, Also, it contains an organic radical initiator composed of an organic peroxide together with a silicon modifier having vinyl groups at both ends. The second composition contains an organic radical initiator composed of an azo compound, together with the epoxy resin, the curing agent, the filler, and the silicon modifier. When the above organic radical initiator is contained, it acts on the vinyl group of the silicon modifier, It causes a polymerization reaction. As a result, the molecular weight of the silicon modifier becomes large, so that the amount of volatilization at the time of molding the mold becomes small, and the mold is prevented from fogging. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001509174-A |
| priorityDate | 1995-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.