abstract |
(57) Abstract: [PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation, which has excellent solder heat resistance, flame retardancy, and high temperature reliability. Furthermore, to provide a semiconductor device in which an electronic circuit portion is sealed with this epoxy resin composition. SOLUTION: As an epoxy resin composition for semiconductor encapsulation, an epoxy resin having a dicyclopentadiene-phenol skeleton is used as the epoxy resin, and a filler is preferably 8 Add 7-95% by weight. |